供应链Semiconductor Digest
Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes
发布方: Semiconductor Digest发布时间: 2026年10月06日 18:41
资讯摘要
New Kalrez 7080 sealing solution strengthens an integrated portfolio of technologies designed to improve yield, reliability, and tool performance. The post Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes appeared first on Semiconductor Digest .
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