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AI 芯片Semiconductor Digest

SEMIFIVE, Mobilint Partner on LPDDR6/UCIe Robotics AI Chip

发布方: Semiconductor Digest发布时间: 2026年10月01日 18:04

资讯摘要

SEMIFIVE, a global provider of custom AI semiconductor (ASIC) solutions, announced today that it has signed a turnkey development contract with Mobilint, a South Korean AI semiconductor company, to develop an AI chip for robotics applications. The post SEMIFIVE, Mobilint Partner on LPDDR6/UCIe Robotics AI Chip appeared first on Semiconductor Digest .

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