Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging

The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor technologies essential to AI computing. The post Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging appeared first on Semiconductor Digest .