X3025WR-04-9TSN
IC
DIP
AvailableNegotiable
X3025WR-04-9TSN
X3025WR-04-9TSN is a XKB Connectivity Wire-to-Board Headers in DIP package.
Brand
XKB Connectivity
Package
DIP
Stock
4,800
Lead Time
In stock
X3025WR-04-9TSN Parameters
| Package | DIP |
|---|---|
| Brand | XKB Connectivity |
| MOQ / SPQ | 1 / 1 |
| 间距 | 3mm |
| 总PIN数 | 4P |
| 每排PIN数 | 4 |
| 触头材质 | 黄铜 |
| Operating Temperature | -40℃~+105℃ |
| 塑料材质 | PA9T |
| Z轴-板上高度 | 4.4mm |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 4,800 |
| 插针结构 | 1x4P |
| Mounting Type | 弯插 |
| 排数 | 1 |
| 额定电流 | 5A |
| 触头镀层 | 锡 |
| 额定电压 | 250V |
| 阻燃等级 | UL94V-0 |
| Y轴-板上底边宽度 | 9.95mm |
X3025WR-04-9TSN Overview
线对板连接器 针座 90度 单排 带柱 9T料 1x05P
X3025WR-04-9TSN Features
No features are available.
X3025WR-04-9TSN Applications
No applications are available.