X2011WV-03A-N0SN
IC
DIP
AvailableNegotiable
X2011WV-03A-N0SN
X2011WV-03A-N0SN is a XKB Connectivity Wire-to-Board Headers in DIP package.
Brand
XKB Connectivity
Package
DIP
Stock
1,985
Lead Time
In stock
X2011WV-03A-N0SN Parameters
| Package | DIP |
|---|---|
| Brand | XKB Connectivity |
| MOQ / SPQ | 1 / 1 |
| 间距 | 2mm |
| 总PIN数 | 3P |
| 每排PIN数 | 3 |
| 触头材质 | 黄铜 |
| Operating Temperature | -25℃~+85℃ |
| 塑料材质 | PA66 |
| X轴-板上底边长度(间距线) | 8mm |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 1,985 |
| 插针结构 | 1x3P |
| Mounting Type | Through-Hole |
| 排数 | 1 |
| 额定电流 | 3A |
| 触头镀层 | 锡 |
| 额定电压 | 250V |
| 阻燃等级 | UL94V-0 |
X2011WV-03A-N0SN Overview
2.0mm 线对板连接器(YH 2.0)针座, 180度, 亮锡, 03P
X2011WV-03A-N0SN Features
No features are available.
X2011WV-03A-N0SN Applications
No applications are available.