WF-XHB2.54-5PA1
IC
插件, P=2.5mm
AvailableNegotiable
WF-XHB2.54-5PA1
WF-XHB2.54-5PA1 is a BXCONN Wire-to-Board Headers in 插件, P=2.5mm package.
Brand
BXCONN
Package
插件, P=2.5mm
Stock
280
Lead Time
In stock
WF-XHB2.54-5PA1 Parameters
| Package | Through-Hole, P=2.5mm |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 280 |
WF-XHB2.54-5PA1 Overview
WF-XHB2.54-5PA1 is a BXCONN Wire-to-Board Headers in 插件, P=2.5mm package.
WF-XHB2.54-5PA1 Features
No features are available.
WF-XHB2.54-5PA1 Applications
No applications are available.