WF-PA2.0-3PF1
IC
SMD, P=2mm, 卧贴
AvailableNegotiable
WF-PA2.0-3PF1
WF-PA2.0-3PF1 is a BXCONN Wire-to-Board Headers in SMD, P=2mm, 卧贴 package.
Brand
BXCONN
Package
SMD, P=2mm, 卧贴
Stock
1,335
Lead Time
In stock
WF-PA2.0-3PF1 Parameters
| Package | SMD, P=2mm, 卧贴 |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 1335 |
WF-PA2.0-3PF1 Overview
WF-PA2.0-3PF1 is a BXCONN Wire-to-Board Headers in SMD, P=2mm, 卧贴 package.
WF-PA2.0-3PF1 Features
No features are available.
WF-PA2.0-3PF1 Applications
No applications are available.