WF-MX3.0-BD3PW1
IC
SMD, P=3mm, 卧贴
AvailableNegotiable
WF-MX3.0-BD3PW1
WF-MX3.0-BD3PW1 is a HMTCONN Wire-to-Board Headers in SMD, P=3mm, 卧贴 package.
Brand
HMTCONN
Package
SMD, P=3mm, 卧贴
Stock
120
Lead Time
In stock
WF-MX3.0-BD3PW1 Parameters
| Package | SMD, P=3mm, 卧贴 |
|---|---|
| Brand | HMTCONN |
| MOQ / SPQ | 1 / 5 |
| Part Number | WF-MX3.0-BD3PW1 |
| Unit | pcs |
| Product Weight | 0.001025833 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 120 |
| Product Name | WF-MX3.0-BD3PW1 |
| Packaging | Tape & Reel |
| Product Type | Wire-to-Board Headers |
WF-MX3.0-BD3PW1 Overview
WF-MX3.0-BD3PW1 is a HMTCONN Wire-to-Board Headers in SMD, P=3mm, 卧贴 package.
WF-MX3.0-BD3PW1 Features
No features are available.
WF-MX3.0-BD3PW1 Applications
No applications are available.