WF-MX1.25-3PA1
IC
插件, P=1.25mm
AvailableNegotiable
WF-MX1.25-3PA1
WF-MX1.25-3PA1 is a BXCONN Wire-to-Board Headers in 插件, P=1.25mm package.
Brand
BXCONN
Package
插件, P=1.25mm
Stock
900
Lead Time
In stock
WF-MX1.25-3PA1 Parameters
| Package | Through-Hole, P=1.25mm |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 10 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 900 |
WF-MX1.25-3PA1 Overview
WF-MX1.25-3PA1 is a BXCONN Wire-to-Board Headers in 插件, P=1.25mm package.
WF-MX1.25-3PA1 Features
No features are available.
WF-MX1.25-3PA1 Applications
No applications are available.