WF-HY2.0-6PA1
IC
插件, P=2mm
AvailableNegotiable
WF-HY2.0-6PA1
WF-HY2.0-6PA1 is a BXCONN Wire-to-Board Headers in 插件, P=2mm package.
Brand
BXCONN
Package
插件, P=2mm
Stock
395
Lead Time
In stock
WF-HY2.0-6PA1 Parameters
| Package | Through-Hole, P=2mm |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 395 |
WF-HY2.0-6PA1 Overview
WF-HY2.0-6PA1 is a BXCONN Wire-to-Board Headers in 插件, P=2mm package.
WF-HY2.0-6PA1 Features
No features are available.
WF-HY2.0-6PA1 Applications
No applications are available.