WF-1F300C11P
IC
SMD, P=3mm, 卧贴
AvailableNegotiable
WF-1F300C11P
WF-1F300C11P is a BXCONN Wire-to-Board Headers in SMD, P=3mm, 卧贴 package.
Brand
BXCONN
Package
SMD, P=3mm, 卧贴
Stock
110
Lead Time
In stock
WF-1F300C11P Parameters
| Package | SMD, P=3mm, 卧贴 |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 1 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 110 |
WF-1F300C11P Overview
WF-1F300C11P is a BXCONN Wire-to-Board Headers in SMD, P=3mm, 卧贴 package.
WF-1F300C11P Features
No features are available.
WF-1F300C11P Applications
No applications are available.