WF-1F254B13P
IC
SMD, P=2.5mm, 卧贴
AvailableNegotiable
WF-1F254B13P
WF-1F254B13P is a BXCONN Wire-to-Board Headers in SMD, P=2.5mm, 卧贴 package.
Brand
BXCONN
Package
SMD, P=2.5mm, 卧贴
Stock
670
Lead Time
In stock
WF-1F254B13P Parameters
| Package | SMD, P=2.5mm, 卧贴 |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 670 |
WF-1F254B13P Overview
WF-1F254B13P is a BXCONN Wire-to-Board Headers in SMD, P=2.5mm, 卧贴 package.
WF-1F254B13P Features
No features are available.
WF-1F254B13P Applications
No applications are available.