WF-1D300B8P
IC
P=3mm
AvailableNegotiable
WF-1D300B8P
WF-1D300B8P is a BXCONN Connector Housings(Wire-to-Board/Wire-to-Wire) in P=3mm package.
Brand
BXCONN
Package
P=3mm
Stock
200
Lead Time
In stock
WF-1D300B8P Parameters
| Package | P=3mm |
|---|---|
| Brand | BXCONN |
| MOQ / SPQ | 1 / 5 |
| Category | Connector Housings(Wire-to-Board/Wire-to-Wire) |
|---|---|
| Stock | 200 |
WF-1D300B8P Overview
WF-1D300B8P is a BXCONN Connector Housings(Wire-to-Board/Wire-to-Wire) in P=3mm package.
WF-1D300B8P Features
No features are available.
WF-1D300B8P Applications
No applications are available.
