WAFER-MX3.0-18PZZ
IC
插件, P=3mm
AvailableNegotiable
WAFER-MX3.0-18PZZ
WAFER-MX3.0-18PZZ is a XUNPU Wire-to-Board Headers in 插件, P=3mm package.
Brand
XUNPU
Package
插件, P=3mm
Stock
188
Lead Time
In stock
WAFER-MX3.0-18PZZ Parameters
| Package | Through-Hole, P=3mm |
|---|---|
| Brand | XUNPU |
| MOQ / SPQ | 1 / 1 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 188 |
WAFER-MX3.0-18PZZ Overview
WAFER-MX3.0-18PZZ is a XUNPU Wire-to-Board Headers in 插件, P=3mm package.
WAFER-MX3.0-18PZZ Features
No features are available.
WAFER-MX3.0-18PZZ Applications
No applications are available.