WAFER-MX1.25-6PWZ-H62
IC
弯插, P=1.25mm
AvailableNegotiable
WAFER-MX1.25-6PWZ-H62
WAFER-MX1.25-6PWZ-H62 is a XUNPU Wire-to-Board Headers in 弯插, P=1.25mm package.
Brand
XUNPU
Package
弯插, P=1.25mm
Stock
3,660
Lead Time
In stock
WAFER-MX1.25-6PWZ-H62 Parameters
| Package | 弯插, P=1.25mm |
|---|---|
| Brand | XUNPU |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 3660 |
WAFER-MX1.25-6PWZ-H62 Overview
WAFER-MX1.25-6PWZ-H62 is a XUNPU Wire-to-Board Headers in 弯插, P=1.25mm package.
WAFER-MX1.25-6PWZ-H62 Features
No features are available.
WAFER-MX1.25-6PWZ-H62 Applications
No applications are available.