WAFER-HY2.0-4PWZ-H62
IC
弯插, P=2mm
AvailableNegotiable
WAFER-HY2.0-4PWZ-H62
WAFER-HY2.0-4PWZ-H62 is a XUNPU Wire-to-Board Headers in 弯插, P=2mm package.
Brand
XUNPU
Package
弯插, P=2mm
Stock
2,390
Lead Time
In stock
WAFER-HY2.0-4PWZ-H62 Parameters
| Package | 弯插, P=2mm |
|---|---|
| Brand | XUNPU |
| MOQ / SPQ | 1 / 10 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 2390 |
WAFER-HY2.0-4PWZ-H62 Overview
WAFER-HY2.0-4PWZ-H62 is a XUNPU Wire-to-Board Headers in 弯插, P=2mm package.
WAFER-HY2.0-4PWZ-H62 Features
No features are available.
WAFER-HY2.0-4PWZ-H62 Applications
No applications are available.