WAFER-HY2.0-2PZZ-R62
IC
插件, P=2mm
AvailableNegotiable
WAFER-HY2.0-2PZZ-R62
WAFER-HY2.0-2PZZ-R62 is a XUNPU Wire-to-Board Headers in 插件, P=2mm package.
Brand
XUNPU
Package
插件, P=2mm
Stock
20
Lead Time
In stock
WAFER-HY2.0-2PZZ-R62 Parameters
| Package | Through-Hole, P=2mm |
|---|---|
| Brand | XUNPU |
| MOQ / SPQ | 1 / 20 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 20 |
WAFER-HY2.0-2PZZ-R62 Overview
WAFER-HY2.0-2PZZ-R62 is a XUNPU Wire-to-Board Headers in 插件, P=2mm package.
WAFER-HY2.0-2PZZ-R62 Features
No features are available.
WAFER-HY2.0-2PZZ-R62 Applications
No applications are available.