WAFER-HA2.54-5PWZ-R62
IC
弯插, P=2.5mm
AvailableNegotiable
WAFER-HA2.54-5PWZ-R62
WAFER-HA2.54-5PWZ-R62 is a XUNPU Wire-to-Board Headers in 弯插, P=2.5mm package.
Brand
XUNPU
Package
弯插, P=2.5mm
Stock
1,825
Lead Time
In stock
WAFER-HA2.54-5PWZ-R62 Parameters
| Package | 弯插, P=2.5mm |
|---|---|
| Brand | XUNPU |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 1825 |
WAFER-HA2.54-5PWZ-R62 Overview
WAFER-HA2.54-5PWZ-R62 is a XUNPU Wire-to-Board Headers in 弯插, P=2.5mm package.
WAFER-HA2.54-5PWZ-R62 Features
No features are available.
WAFER-HA2.54-5PWZ-R62 Applications
No applications are available.