WAFER-GH1.25-3PWB
IC
SMD, P=1.25mm
AvailableNegotiable
WAFER-GH1.25-3PWB
WAFER-GH1.25-3PWB is a XUNPU Wire-to-Board Headers in SMD, P=1.25mm package.
Brand
XUNPU
Package
SMD, P=1.25mm
Stock
3,850
Lead Time
In stock
WAFER-GH1.25-3PWB Parameters
| Package | SMD, P=1.25mm |
|---|---|
| Brand | XUNPU |
| Date Code | 26+ |
| 插针结构 | 1x3P |
| Mounting Type | 卧贴 |
| 总PIN数 | 3P |
| 每排PIN数 | 3 |
| 触头材质 | 黄铜 |
| Operating Temperature | -25℃~+85℃ |
| 塑料材质 | LCP |
| 颜色 | 米色 |
| X轴-板上底边长度(间距线) | 7mm |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 3,850 |
| MOQ / SPQ | 1 / 1 |
| 间距 | 1.25mm |
| 参考系列 | GH |
| 排数 | 1 |
| 额定电流 | 1A |
| 触头镀层 | 锡 |
| 额定电压 | 125V |
| 附加特征 | 辅助焊脚 |
| Z轴-板上高度 | 4.35mm |
| Y轴-板上底边宽度 | 5mm |
WAFER-GH1.25-3PWB Overview
线对板针座 1x3P GH SMD, P=1.25mm, 卧贴
WAFER-GH1.25-3PWB Features
No features are available.
WAFER-GH1.25-3PWB Applications
No applications are available.