WAFER-254W-9P
IC
SMD, P=2.5mm, 卧贴
AvailableNegotiable
WAFER-254W-9P
WAFER-254W-9P is a XUNPU Wire-to-Board Headers in SMD, P=2.5mm, 卧贴 package.
Brand
XUNPU
Package
SMD, P=2.5mm, 卧贴
Stock
305
Lead Time
In stock
WAFER-254W-9P Parameters
| Package | SMD, P=2.5mm, 卧贴 |
|---|---|
| Brand | XUNPU |
| MOQ / SPQ | 1 / 5 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 305 |
WAFER-254W-9P Overview
WAFER-254W-9P is a XUNPU Wire-to-Board Headers in SMD, P=2.5mm, 卧贴 package.
WAFER-254W-9P Features
No features are available.
WAFER-254W-9P Applications
No applications are available.