W30022K-18PB123
IC
P=3.03mm
AvailableNegotiable
W30022K-18PB123
W30022K-18PB123 is a HMTCONN Connector Housings(Wire-to-Board/Wire-to-Wire) in P=3.03mm package.
Brand
HMTCONN
Package
P=3.03mm
Stock
200
Lead Time
In stock
W30022K-18PB123 Parameters
| Package | P=3.03mm |
|---|---|
| Brand | HMTCONN |
| MOQ / SPQ | 1 / 5 |
| Category | Connector Housings(Wire-to-Board/Wire-to-Wire) |
|---|---|
| Stock | 200 |
W30022K-18PB123 Overview
W30022K-18PB123 is a HMTCONN Connector Housings(Wire-to-Board/Wire-to-Wire) in P=3.03mm package.
W30022K-18PB123 Features
No features are available.
W30022K-18PB123 Applications
No applications are available.