RP2D182YR700S68CE006
IC
插件, D30xL70mm
AvailableNegotiable
RP2D182YR700S68CE006
RP2D182YR700S68CE006 is a HUAWEI Snap-InElectrolyticCapacitors in 插件, D30xL70mm package.
Brand
HUAWEI
Package
插件, D30xL70mm
Stock
2,000
Lead Time
In stock
RP2D182YR700S68CE006 Parameters
| Package | Through-Hole, D30xL70mm |
|---|---|
| Brand | HUAWEI |
| MOQ / SPQ | 1 / 1 |
| Category | Snap-InElectrolyticCapacitors |
|---|---|
| Stock | 2000 |
RP2D182YR700S68CE006 Overview
RP2D182YR700S68CE006 is a HUAWEI Snap-InElectrolyticCapacitors in 插件, D30xL70mm package.
RP2D182YR700S68CE006 Features
No features are available.
RP2D182YR700S68CE006 Applications
No applications are available.