I-DS1069-03-SCW007
IC
P=2.5mm
AvailableNegotiable
I-DS1069-03-SCW007
I-DS1069-03-SCW007 is a CONNFLY Connector Housings(Wire-to-Board/Wire-to-Wire) in P=2.5mm package.
Brand
CONNFLY
Package
P=2.5mm
Stock
980
Lead Time
In stock
I-DS1069-03-SCW007 Parameters
| Package | P=2.5mm |
|---|---|
| Brand | CONNFLY |
| MOQ / SPQ | 1 / 5 |
| Category | Connector Housings(Wire-to-Board/Wire-to-Wire) |
|---|---|
| Stock | 980 |
I-DS1069-03-SCW007 Overview
I-DS1069-03-SCW007 is a CONNFLY Connector Housings(Wire-to-Board/Wire-to-Wire) in P=2.5mm package.
I-DS1069-03-SCW007 Features
No features are available.
I-DS1069-03-SCW007 Applications
No applications are available.