HP2P331MP300S55CE0
IC
插件, D22xL30mm
AvailableNegotiable
HP2P331MP300S55CE0
330uF ±20% 220V
Brand
HUAWEI
Package
插件, D22xL30mm
Stock
14
Lead Time
In stock
HP2P331MP300S55CE0 Parameters
| Package | Through-Hole, D22xL30mm |
|---|---|
| Brand | HUAWEI |
| MOQ / SPQ | 1 / 1 |
| Category | Snap-InElectrolyticCapacitors |
|---|---|
| Stock | 14 |
HP2P331MP300S55CE0 Overview
330uF ±20% 220V
HP2P331MP300S55CE0 Features
No features are available.
HP2P331MP300S55CE0 Applications
No applications are available.