HLK-B25
IC
SMD, 14x9.5mm
AvailableNegotiable
HLK-B25
HLK-B25 is a HI-LINK BluetoothModules in SMD, 14x9.5mm package.
Brand
HI-LINK
Package
SMD, 14x9.5mm
Stock
186
Lead Time
In stock
HLK-B25 Parameters
| Package | SMD, 14x9.5mm |
|---|---|
| Brand | HI-LINK |
| Date Code | 26+ |
| 接口类型 | ADC； I2C |
| 发射功率 | 8dBm |
| 接收电流 | 9.7mA |
| 通讯距离 | 50m |
| Operating Temperature | -40℃~+85℃ |
| Category | BluetoothModules |
|---|---|
| Stock | 186 |
| MOQ / SPQ | 1 / 1 |
| 支持协议 | Bluetooth5.3 |
| 工作电压 | 1.8V~3.4V |
| 发送电流 | 8mA |
| 接收灵敏度 | -92dBm |
| 功能特性 | OTA空中升级 |
HLK-B25 Overview
HLK-B25是一款BLE5.3主从一体蓝牙-串口透传模块， 各种带有串口的设备通过本模块， 都能够简单快速的使用蓝牙无线收发数据。
HLK-B25 Features
No features are available.
HLK-B25 Applications
No applications are available.