HBR330M1HBK-0608
IC
插件, D6.3xL8mm
AvailableNegotiable
HBR330M1HBK-0608
HBR330M1HBK-0608 is a Lelon Hybrid PolymerAluminum ElectrolyticCapacitorsDevices in 插件, D6.3xL8mm package.
Brand
Lelon
Package
插件, D6.3xL8mm
Stock
525
Lead Time
In stock
HBR330M1HBK-0608 Parameters
| Package | Through-Hole, D6.3xL8mm |
|---|---|
| Brand | Lelon |
| MOQ / SPQ | 1 / 5 |
| Category | Hybrid PolymerAluminum ElectrolyticCapacitorsDevices |
|---|---|
| Stock | 525 |
HBR330M1HBK-0608 Overview
HBR330M1HBK-0608 is a Lelon Hybrid PolymerAluminum ElectrolyticCapacitorsDevices in 插件, D6.3xL8mm package.
HBR330M1HBK-0608 Features
No features are available.
HBR330M1HBK-0608 Applications
No applications are available.
