H300019-08-01
IC
SMD, P=3mm, 卧贴
AvailableNegotiable
H300019-08-01
H300019-08-01 is a LXWCONN Wire-to-Board Headers in SMD, P=3mm, 卧贴 package.
Brand
LXWCONN
Package
SMD, P=3mm, 卧贴
Stock
50
Lead Time
In stock
H300019-08-01 Parameters
| Package | SMD, P=3mm, 卧贴 |
|---|---|
| Brand | LXWCONN |
| MOQ / SPQ | 1 / 1 |
| Category | Wire-to-Board Headers |
|---|---|
| Stock | 50 |
H300019-08-01 Overview
H300019-08-01 is a LXWCONN Wire-to-Board Headers in SMD, P=3mm, 卧贴 package.
H300019-08-01 Features
No features are available.
H300019-08-01 Applications
No applications are available.