CK45-B3FD681KYVNA
IC
插件, P=7.5mm
AvailableNegotiable
CK45-B3FD681KYVNA
CK45-B3FD681KYVNA is a TDK Through-HoleCeramic DiscCapacitors in 插件, P=7.5mm package.
Brand
TDK
Package
插件, P=7.5mm
Stock
730
Lead Time
In stock
CK45-B3FD681KYVNA Parameters
| Package | Through-Hole, P=7.5mm |
|---|---|
| Brand | TDK |
| MOQ / SPQ | 1 / 10 |
| Category | Through-HoleCeramic DiscCapacitors |
|---|---|
| Stock | 730 |
CK45-B3FD681KYVNA Overview
CK45-B3FD681KYVNA is a TDK Through-HoleCeramic DiscCapacitors in 插件, P=7.5mm package.
CK45-B3FD681KYVNA Features
No features are available.
CK45-B3FD681KYVNA Applications
No applications are available.