CD74HC374M96
IC
SOIC-20-300mil
AvailableNegotiable
CD74HC374M96
CD74HC374M96 is a TI Flip-Flops in SOIC-20-300mil package.
Brand
TI
Package
SOIC-20-300mil
Stock
38
Lead Time
In stock
CD74HC374M96 Parameters
| Package | SOIC-20-300mil |
|---|---|
| Brand | TI |
| MOQ / SPQ | 1 / 1 |
| Category | Flip-Flops |
|---|---|
| Stock | 38 |
CD74HC374M96 Overview
CD74HC374M96 is a TI Flip-Flops in SOIC-20-300mil package.
CD74HC374M96 Features
No features are available.
CD74HC374M96 Applications
No applications are available.