CD74AC574M96
IC
SOIC-20-300mil
AvailableNegotiable
CD74AC574M96
CD74AC574M96 is a TI Flip-Flops in SOIC-20-300mil package.
Brand
TI
Package
SOIC-20-300mil
Stock
23
Lead Time
In stock
CD74AC574M96 Parameters
| Package | SOIC-20-300mil |
|---|---|
| Brand | TI |
| MOQ / SPQ | 1 / 1 |
| Category | Flip-Flops |
|---|---|
| Stock | 23 |
CD74AC574M96 Overview
CD74AC574M96 is a TI Flip-Flops in SOIC-20-300mil package.
CD74AC574M96 Features
No features are available.
CD74AC574M96 Applications
No applications are available.