CC45SL3DD330JYVNA
IC
径向， 圆片式
AvailableNegotiable
CC45SL3DD330JYVNA
CC45SL3DD330JYVNA is a TDK Through-HoleCeramic DiscCapacitors in 径向， 圆片式 package.
Brand
TDK
Package
径向， 圆片式
Stock
1,482
Lead Time
In stock
CC45SL3DD330JYVNA Parameters
| Package | 径向， 圆片式 |
|---|---|
| Brand | TDK |
| Date Code | 26+ |
| Capacitance | 33pF |
| 额定电压 | 2kV |
| Temperature Coefficient | SL |
| 电容体厚度 | 5mm |
| Category | Through-HoleCeramic DiscCapacitors |
|---|---|
| Stock | 1,482 |
| MOQ / SPQ | 1 / 1 |
| Tolerance | ±5% |
| 脚间距 | 5mm |
| 电容体直径 | 5.5mm |
CC45SL3DD330JYVNA Overview
直插瓷片电容 2kV ±5% 33pF 插件, P=5mm
CC45SL3DD330JYVNA Features
No features are available.
CC45SL3DD330JYVNA Applications
No applications are available.